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材料特点:

1.高Tg低损耗无铅高速材料

2.材料Tg≥180 °C(DSC), Df≤0.007(@10GHz)

3.低CTE及抗CAF可靠性,优良的信号完整性

4.不同环境下Dk/Df优良的稳定性

Material Characteristics

1.High Tg low loss lead-free high speed material

2.Material TG≥180 °C (DSC), DF≤0.007 (@ 10GHz)

3.Low CTE and anti CAF reliability, excellent signal integrity

Excellent stability of Dk / DF in different environments

产品应用:

伺服器、储存、转换器、背板、路由、5G通讯网络

对等材料:IX-X50DXX\EX88X. XU8X2SLK、MXXX4

Product Application

Server, Storage, Converter, backplane, routing, 5G

Communication network

Equivalent material: IX-X50DXX\EX88X. XU8X2SLK、MXXX4