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材料特点：

1.无铅高Tg材料  

2.材料Tg≥170。C(DSC),Td≥345。C  

3.与FR-4制造工艺兼容  

4.低Z-CTE及高耐热信赖性,良好的抗CAF能力 

Material Characteristics

1.Lead free high Tg material

2.MaterialTG≥170。C (DSC),TD≥345 °C

3.Compatible with FR-4 manufacturing process

4.Low Z-CTE and high heat-resistant reliability,excellent CAF resistance

产品应用：

汽车板、多层板、HDI产品、背板、数据储存、服务器、网络通讯、厚铜板  

对等材料:IX-X8XX\XM827\370HX  

Product Application

Automobile board, multilayer board, HDI product,backplane, data storage, server, network communication,thick copper plate

Equivalent material:IX-X8XX)XM827\370HX